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Silicon Wafers in plastic holder box

Wet Etching & Cleaning

Enhanced Solutions for Wet Etching and Cleaning in Semiconductor Fabrication

As device dimensions continue to shrink, the ability to remove particles and other contaminants from the wafer surface is critical to achieving high yields. The materials of construction for wet etch and clean equipment must be resistive to the aggressive chemicals used in these baths and pure enough that they do not contaminate the wafer in the process.

 

Products for High-Performance Wet Processes

Depending on the requirements of the wet process in question, Syensqo has a portfolio of materials to match your specific chemical resistance, purity, sustainability, and safety priorities. Halar® ECTFE, Solef® PVDF, Tecnoflon® FKM & FFKM, KetaSpire® PEEK and Ryton® PPS,are all materials commonly found in semiconductor wet process equipment.

Key Materials for Advanced Wet Etching Applications 

Our advanced solutions enhance many key wet etching components. Syensqo’s materials optimize components including the chemical delivery system, structural parts, o-rings and seals, UPW piping system and wafer containers.

 

Chemical Delivery System

Halar® ECTFE and Solef® PVDF improve the chemical delivery system used in wet etching. 

 

Structural Parts

Halar® ECTFE offers chemically resistant and thermally stable properties to meet the need for the high purity conditions of wet processing equipment. 

 

O-Rings and Seals

Tecnoflon® Fluoroelastomers (FKM) and Perfluorelastomers (FFKM) enhance O-rings and seals that are used in the semiconductor fabrication process and require a unique combination of properties to ensure optimal performance. 

 

UPW Piping System 

Solef® PVDF and KetaSpire® PEEK meet UPW’s special contamination specifications for high-purity conditions while simultaneously satisfying long-term mechanical and performance demands.

 

Wafer Containers

Wafer container manufacturers trust Syensqo to supply durable materials such as KetaSpire® PEEK which offer high-temperature service and virtually universal chemical resistance.