Semiconductors

Chemical Mechanical Planarization (CMP) is a crucial semiconductor manufacturing process that combines chemical and mechanical forces to achieve a flat, smooth wafer surface. It involves using a slurry and polishing pad to remove material, ensuring uniformity and reliability in integrated circuits and other microelectronic devices.

With the use of plasma, manufacturers remove excess materials and clean semiconductor surfaces during the patterning of shaping of each layer. Syensqo’s comprehensive portfolio of solutions for dry etching and cleaning include specialty polymers for structural and internal vacuum chamber parts, heat transfer fluids, seals, and lubricants for vacuum pumps.

Ion implantation is used to dope different regions of the silicon chip as n-type or p-type and is fundamental to manufacturing semiconductor devices. To precisely control the electrical properties of the doped regions, extremely pure materials are essential. Syensqo offers high-purity material solutions for the most demanding ion implantation applications.

As shrinking dimensions of transistors become more difficult and expensive to produce, chip manufacturers are getting more creative about how they package and stack their chips in order to extract added performance. Semiconductor packaging will have a significant impact on the affordability of high-performance chips. Syensqo has engineered enhanced material solutions to facilitate continued advancements in semiconductor packaging operations.

As an essential stage to test semiconductor functionality, probing requires several unique materials to ensure high-quality test performance. Syensqo’s  heat transfer fluids and structural materials for probe cards offer a stable, controlled environment for reliable probing.

As the functionalities and performance features of semiconductors evolve, testing processes must adapt along with them. Syensqo’s  high-performance specialty polymers are optimal solutions for test sockets and handlers that are essential to semiconductor testing.

Wafer handling involves the precise and contamination-free movement, storage, and processing of semiconductor wafers during manufacturing. This includes automated systems and tools designed to transport wafers between various stages, ensuring their integrity and cleanliness, which is critical for producing high-quality integrated circuits and microelectronic devices.

Wet etching and cleaning processes are equally important in transferring patterns and cleaning surfaces after material removal. Syensqo provides semiconductor manufacturers with a versatile range of high-performance solutions that achieve efficient wet etching and wet cleaning. Syensqo’s  high-purity polymers also deliver outstanding results in structural parts for wet process equipment, UPW piping systems, chemical delivery systems, filters, valves and more.