Industry-Leading Purity and Performance for Tomorrow’s Semiconductor Chips
Modern semiconductor manufacturing demands o-rings with excellent sealing properties, ultra-high purity and exceptional durability in extreme processing environments. Tecnoflon® FFKM resins provide advanced sealing solutions that ensure reliable performance in wet etch and clean, plasma, diffusion, cryo etch processes and more.
As semiconductor manufacturers prioritize sustainability and supply security, Syensqo leads the way with our NFS (Non-Fluorosurfactant) FFKM portfolio. These solutions are manufactured without the use of surfactants while delivering the industry’s most dependable and contamination-free sealing technologies.
Optimal Durability for All Purpose & Wet Process
Tecnoflon® FFKM peroxide-curable resins meet the most stringent purity and chemical resistance requirements for semiconductor wet etch and clean or dry vacuum environments. These general-use Tecnoflon® PFR grades provide superior durability against aggressive chemicals, ensuring reliable sealing capabilities and extended service life.
Excellence in Dry Process Applications
For dry process semiconductor applications, Syensqo’s nitrile FFKMs deliver low outgassing, excellent plasma resistance and long lifetime performance while reaching temperatures up to 300°C in indirect plasma applications. These materials also serve as a stable matrix for plasma-resistant organic fillers, further enhancing their suitability for dry semiconductor environments.
High-Temperature Integrity
As semiconductor chamber temperatures begin to exceed 300°C more often, Syensqo continues to push the boundaries of material performance to meet these new challenges. Our nitrile-curable FFKMs are designed to provide extended sealing life beyond 315°C, ensuring high-integrity performance in elevated temperatures.
Purity and Longevity for Plasma Process
Syensqo’s Tecnoflon® FFKMs for plasma processes are engineered to withstand harsh chemical exposure and physical bombardment inside plasma chambers. Their co-coagulated organic filler technology offers superior stability, extending seal longevity and reducing contamination risks among organic filled materials.
Low-Temperature Stability and Performance
Though FKM is generally a choice material for cryo applications, some chemical or plasma environments require FFKM-level stability. For cryogenic semiconductor etch processes where stability is critical—such as advanced memory fabrication—Tecnoflon® FFKM offers an ultra-low-temperature sealing solution that maintains elasticity and durability despite extreme cryo conditions.
Exceptional Resilience for Sub-Fabrication Applications
For facilities (or sub-fab) applications—such as vacuum pumps, abatement systems and support infrastructure—Syensqo offers our Tecnoflon® SHP grades, which provide the chemical and thermal resistance of Tecnoflon PFR with relaxed requirements around purity. This makes them a choice material solution for sub-fab environments where limits for metal and ionic contamination levels are not as demanding as fab-level applications.
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