Tecnoflon® FKM
Tecnoflon® FKM delivers a balance of chemical resistance, thermal stability and low permeability, making it suitable for general-purpose semiconductor sealing applications. It is commonly used in etching, deposition and lithography tools, where moderate chemical exposure and moderate temperature stability are required.
Key Benefits:
- Strong chemical resistance to solvents, acids and etchants in wet processes
- Low temperature flexibility for performance in cryogenic applications
- Low gas permeability to prevent contamination in vacuum applications
Tecnoflon® FFKM
Tecnoflon® FFKM offers maximum chemical and thermal resistance, making it the preferred choice for plasma etching, diffusion, CVD and high-vacuum sealing applications. With superior purity and long-term durability, it ensures contamination-free operation in critical semiconductor processes.
Key Benefits:
- Excellent resistance to plasma, reactive gases and aggressive chemicals
- Ultra-low outgassing to maintain purity in vacuum applications
High thermal stability for sustained performance in elevated temperature environments (above 300°C)
Tecnoflon® FFKM NFS
Tecnoflon® FFKM NFS is the industry’s first Non-Fluorosurfactant perfluoroelastomer, delivering unmatched purity. It offers the same high performance as conventional FFKM, eliminating the use of fluorosurfactants to enhance environmental responsibility without sacrificing sealing integrity.
Key Benefits:
- Proprietary Non-Fluorosurfactant technology
- Exceptional chemical and thermal resistance for extreme semiconductor environments
- Long service life with contamination-free sealing for high-precision processes
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