Dry Etching & Cleaning

Enhanced Solutions for Dry Etching

Dry etching, an eco-friendly alternative to conventional wet etching, refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases) that dislodge portions of the material from the exposed surface. Directed pressure under vacuum conditions allows for optimization by using gas mixtures to create a reaction that affects the wafer surface. Dry etching is a quick process that does not require much operator training. 

Syensqo’s unique dry etching and cleaning solutions offer a variety of performance advantages for effective semiconductor fabrication.

Products for high-Performance Dry Etching 

Syensqo's expansive offering of materials for dry etching and cleaning are revolutionizing the market with polymers for tools and fluids, such as Fomblin® PFPE, Galden® PFPE, Tecnoflon® FKM & PFR FFKM, Ketaspire® PEEK and Torlon® PAI.

Key Materials for Advanced Dry Etching Applications 

Cleanliness is crucial in dry etching, and materials used in these processes must be equipped with excellent chemical and heat resistance. Our innovative portfolio of specialty polymers impart several critical properties to improve dry etching tools and processes for efficient semiconductor fabrication. Syensqo offers a variety of solutions for dry etching fluids and lubricants and enhanced dry etching tools,  

Fluids and Lubricants

Fluids and lubricants used in semiconductor fabrication and dry etching must exhibit high temperature and chemical resistance to withstand the demanding conditions of these processes. Fomblin® PFPE lubricants offer an exceptional solution for vacuum pumps used during the dry etching process. Galden® PFPE, available in a variety of grades, is ideal for semiconductor chillers. 

Dry Etching Tools

Manufacturers of dry etching tools continually seek material solutions with plasma resistance, outstanding mechanical, chemical, and structural abilities, combined with unique design flexibility and processability. Tecnoflon® FKM & PFR FFKM provide an advanced material selection for o-rings and seals, while Ketaspire® PEEK is excellent for structural components in etching tools and Torlon® PAI is a preferred polymer for internal parts of plasma chambers.