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Silicon Wafers and Microcircuits with Automation system control application on automate robot arm

Chemical Mechanical Planarization (CMP)

Versatile Solutions for CMP Applications  

As semiconductor fabrication technologies continue to advance, OEMs require components that meet demanding performance requirements for the single nanometer precision needed for today’s chemical-mechanical planarization (CMP) processes. The CMP process requires exceptional materials, which must withstand harsh chemicals, high temperatures, abrasion, and high forces while maintaining single nanometer precision.

Syensqo continues to propel the semiconductor industry forward with innovative materials that improve modern CMP processes. With the broadest portfolio on the market, our selection of specialty solutions and polymers for CMP enable the development of highly advanced semiconductor applications and components.

Advancements in the CMP Process

Syensqo's sophisticated solutions for CMP processes provide superior mechanical properties, chemical resistance, and purity for structural components, retainer rings, polishing pads, chemical delivery systems, and slurry abrasives. Our groundbreaking materials allow CMP engineers to continue to push the boundaries of what is possible.

 

Structural Parts for CMP Equipment

CMP structural parts require exceptional mechanical and physical properties together with anti-stick performance and strong chemical resistance. Solef® PVDF and Halar® ECTFE, have good dimensional stabilities and mechanical properties under harsh chemicals and high operation temperatures, making them good choices for CMP tool construction.

 

Retainer Rings

Retainer rings need high-performance thermoplastics with incredible dimensional stability, low particulation, high wear resistance,   and fatigue resistanceRyton® PPSKetaSpire® PEEKAvaSpire® PAEK, and Torlon® PAI are ideal for semiconductor applications like CMP rings and etch chamber components as well as in wafer handling equipment such as cassettes.


Chemical Delivery System

The flow rate of chemicals in the CMP process is of utmost importance between the slurry and polishing pads. The chemical delivery system calls for innovative materials that promote a clean, polished operation and surface. Halar® ECTFE and, Solef® PVDFoffer processing stability, improved surface smoothness and chemical resistance.