Exceptional Cleanliness in Wafer Handling
In semiconductor manufacturing processes, materials that come into physical contact with the silicon wafer must meet high cleanliness and dimensional stability standards. The material must also be very resistant to physical stresses, as the fragile wafers must be transported between thousands of processing steps before their journey is complete.
Syensqo’s specialty solutions enable OEMs to produce clean, reliable wafer handling parts that manufacturers can rely on to carefully transport their valuable wafers through the entire fabrication process.
Advanced Products for Wafer Handling
Our progressive portfolio of solutions enables OEMs to produce wafer handling tools with qualities such as superior strength and chemical resistance. Cleanliness is of utmost importance for wafer handling and transfer, so the cassettes must also maintain an inside environment that is free of particles and organic contamination. Syensqo’s advanced products for wafer handling include KetaSpire® PEEK andUdel® PSU.
Wafer Handling Equipment and Containers
The Front Opening Universal Pod (FOUP) and the Standard Mechanical Interface (SMIF) are two wafer handling tools that require exceptionally unique materials to meet stringent cleanliness and security requirements.
Front Opening Universal Pod (FOUP)
The Front Opening Universal Pod (FOUP) is typically used for 300 mm wafers in semiconductors and requires materials that offer resistance to chemicals and superior strength to keep the wafer safe.
Standard Mechanical Interface (SMIF)
The Standard Mechanical Interface (SMIF) is appropriate for 200 mm wafers in semiconductors and functions similarly to the FOUP. Both SMIF and FOUP applications need to withstand high temperatures and remain excessively clean.
Explore all products for Semiconductors
