Innovative Material Solutions for Hyperconnectivity
With the ever-involving influx of 5G telecommunication applications, challenges in dielectric management, miniaturization, aesthetics, productivity and cost arise. Manufacturers seek to create products with faster speeds, more data volume, less latency and errors, better network availability and coverage and fiber-like performance.
Syensqo's advanced portfolio offers a variety of materials with enhanced dielectric properties, heat resistance and structural toughness. Our solutions support next-generation innovation in hyperconnectivity with unparalleled performance that enables manufacturers to design 5G equipment and devices successfully.
Our Solutions for Telecommunications & 5G
5G Components
Increased miniaturization, conductivity and complexity of electrical components leads to greater material demands. Specialty polymers can replace metals to offer unparalleled design flexibility with strength, rigidity and improved aesthetics in mobile phones, tablets and laptops. Printed Circuit Boards (PCB), Flexible Printed Circuits (FPC), and fiber optics applications in particular benefit greatly from our broad portfolio.
Base Station
Base stations increasingly require lightweighting, better radio performance, less site space, efficiency, system cost reduction and thermal management. Our solutions assist in fulfilling all of these demands, for example in antennae units and wire and cable.
Server Cooling
As an alternative to mainframe computers, server farms often consist of thousands of computers, requiring many electric fans to keep them cool. With these stringent requirements, server cooling is in high demand and calls for exceptional materials, especially when it comes to High Performance Computing (HPC)/data centers.
Advanced Materials to Improve 5G Applications
Our broad portfolio supports our customer’s next-generation hyper-connectivity innovation with a specific focus on dielectric performance, heat resistance and structure performance. Our solutions are ideal for OEMs following the 5G product trend in future equipment.
