Usages

Sophisticated Solutions for Semiconductor Packaging Applications

Semiconductor packaging applications require excellent precision and protection. OEMs demand packaging parts that can withstand aggressive environments and provide smooth, stable surfaces. Syensqo’s material portfolio is compatible with a broad range of environments, ensuring that chips are protected through the varied conditions seen throughout the process.

Mold Release Film (MRF)

For epoxy molding processes, Mold Release Film (MRF) requires excellent heat resistance and releasability so that chips can be effectively released from the heated mold. Halar® ECTFE  protect the package from cracking during mold release and reduce downtime by preventing burrs or flash from forming on the mold surfaces.

IC Tray 

In semiconductor packaging, IC trays in a variety of shapes and sizes are used for inspection and transport. Veradel® PESU and Udel® PSU offer enhanced physical and thermal protection for electronic devices. 

Flip Chip Ball Grid Array (BGA)

The flip chip ball grid array (FC BGA) must be increasingly thinner, smaller, and flatter to meet increasingly stringent demands of flip chip processes. 

Torlon® PAI, KetaSpire® PEEK and AvaSpire® PEAKhave low thermal expansion, which prevents the cracking and breaking of thin, vulnerable parts. Both of these materials are incredibly strong and robust, making them outstanding solutions for FC BGA. 

High Temp Tray

High temp trays in semiconductor packaging require excellent chemical and thermal resistance as well as antistatic properties. Torlon® PAI, KetaSpire® PEEK and AvaSpire® PEAK meet the needs of this demanding application.