Products

Materials that Enhance Semiconductor Packaging

Semiconductor manufacturers need high-quality, durable materials for packaging applications that can withstand high heat, chemical harshness and physical stresses. Syensqo offers material solutions that provide key capabilities, from intrinsic processing stability to high thermal service. These materials reduce contamination and risk for breakage so that electronic parts remain clean and safe.

• Halar® ECTFE - As a partially fluorinated semi-crystalline polymer, Halar® ECTFE offers a unique combination of properties for highly demanding industries. It’s resistant to chemical and high heat, simultaneously offering purity and surface smoothness to reduce the risk of contamination buildup and corrosion.  
• Veradel® PESU - As a high-performing, amorphous thermoplastic, Veradel® PESU is incredibly tough. It retains strength to 180C°, is resistant to many harsh chemicals, offers higher thermal capability, inherent flame resistance and mechanical properties. It offers more toughness, strength and hydrolytic stability than other transparent engineering plastics.  
• Udel® PSU - As a transparent plastic with high strength and rigidity, Udel® PSU offers better hydrolytic stability than polycarbonate. It also provides combustion resistance, transparency and low creep in demanding applications.   
• Torlon® PAI - With unsurpassed wear resistance, Torlon® PAI retains high strength and offers exceptional dimensional stability. It is also resistant to creep under load and most chemicals, acids and solvents while providing clean, contaminant-free surfaces.