Superior Polymers for Cutting-Edge Smartphones and PCs
Syensqo's portfolio of superior polymers for cutting-edge smartphones and PCs is equipped with a wide range of aromatic polymers, ultra polymers and sulfone resins. Each brand in our offering provides a unique set of properties and attributes, which supplies OEMs with a selection of tailored solutions for the given application. As the industry leader in specialty polymers for smart devices and personal computing, Syensqo's innovative portfolio helps OEMs innovate within this ever-evolving market with reliable, globally available materials.
- Ixef® PARA - A polyarylamide with an exceptional combination of strength, stiffness and surface aesthetics, Ixef® PARA is optimal for several structural applications within smartphones and PCs. Ixef® PARA introduces exceptional dielectric properties and tremendous rigidity ideal for antenna splits and cover applications in modern smartphones and PCs. The excellent dielectric performance of this alloy of semi-crystalline aromatic polyarylamide provides antenna splits with good radio frequency signal transparency when it is over molded with stainless steel frames. Additionally, Ixef® PARA is equipped with the required strength, stiffness and flow for ultra thin-walls, which are commonly needed for antenna splits and covers in next-generation smartphones and PCs.
- Kalix® HPPA - A high-performance polyamide strategically formulated for structural components in smartphones and PCs, Kalix® HPPA is available in a variety of grades. Kalix® HPPA offers an optimal combination of stiffness and ductility that facilitates complex parts for electronic devices that require extremely high strength, outstanding impact resistance and high-quality surface finishes. Kalix® HPPA also shows low moisture absorption and retains high dimensional stability and flatness even after long term usage, which makes it an ideal structural material for precision electronics components in smartphones and PCs. This impressive blend of unique characteristics meets and exceeds the performance demands of structural and cosmetic frames for smartphones and PCs, as well as enables improved design flexibility for OEMs.
- Amodel® PPA - An aromatic polyamide designed to outperform traditional materials used in electronics manufacturing, Amodel® PPA exhibits excellent mechanical and heat resistance properties. This superior polyamide displays extremely high performance even when exposed to harsh, high temperature environments, making it optimal for a variety of structural and cosmetic applications in modern smartphones and PCs components. Amodel® PPA also offers ease of processing for OEMs, due to its property retention abilities.
- Ryton® PPS - A unique polyphenylene sulfide, Ryton® PPS displays excellent cost-performance balance for an array of structural applications and usages in smartphones and PCs. Ryton® PPS is equipped with outstanding thermal stability, flame retardance, creep resistance and chemical resistance, which make it well-suited for both plastic-metal hybrid structural frames and antenna splits.
- AvaSpire® PAEK - A semi-crystalline, ultra polymer, AvaSpire® PAEK is ideal for some of the most demanding smartphone and PC applications. This highly evolved PEEK offers good mechanical toughness, NMT compatibility and impressive structural design freedom, making it a choice material for a range of hybrid components. AvaSpire® PAEK provides outstanding mechanical properties, chemical resistance and thermal stability for specialized structural applications such as plastic-metal hybrid structures.
- Radel® PPSU - A premium sulfone resin, this polyphenylsulfone leads sulfone polymers in performance, as it displays superb impact and chemical resistance, excellent flexibility and outstanding ductility. Radel® PPSU is optimal for flexible structural frames and various plastic-metal hybrid structures in some of today's most advanced smartphones and PCs.
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