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Defense

Products

Reliable Solutions for Defense Applications

Syensqo’s diverse portfolio of aerospace defense composites and aerospace defense adhesives have achieved benchmark status within the industry. Our high-quality prepreg resins, adhesives, and specialty polymer solutions enable exceptional property retention and performance for reliable defense applications in any stage of production; from prototyping to end-use scenarios. These products can also be procured through Syensqo’s US subsidiary business, contact CDM to hear more.

 

  • Additive Manufacturing - Our portfolio of outstanding polymer filaments for 3D Printing offers the highest levels of strength, stiffness, flame retardancy, chemical resistance, and reliable performance in high and low-temperature environments. These polymers for aerospace defense are durable, lightweight, and corrosion-free alternatives to metal, which makes them the ideal solution for tooling, aerospace additive manufacturing, fixtures, and more.
  • CYCOM® - CYCOM® prepregs provide excellent structural performance for challenging composite defense applications. Featuring weight savings and manufacturing benefits, CYCOM® is ideal for primary and secondary aircraft structure reinforcement.
  • MTM® - MTM® stands for Medium Temperature Molding, a series of prepreg resins and associated adhesives for toughened systems and aerospace industry applications. This series of adhesives and prepregs are ideal for the molding and adhesion needs of primary and secondary aircraft structures. 
  • APC - APC Is a trusted thermoplastic composite brand known for measurable weight and manufacturing advantages without sacrificing performance. With outstanding environmental and creep resistance, APC thermoplastic composite tapes outperform traditional metallic materials used in defense applications.
  • BR® - Known for its performance in extreme-demand environments, BR® bonding primers improve adhesion while inhibiting material degradation. BR® primers answer specific flexibility, stability, and corrosion challenges in the most challenging defense applications. 
  • FM® - This portfolio of structural film and foam adhesives meets precise temperature, environmental and cure requirements without sacrificing high-performance properties in demanding environments. FM® films and adhesives are designed for metal-to-metal, composite-to-metal, and composite-to-composite bonding across various industries.
  • FusePly™ - Eliminating the need for multiple rivets and fasteners, FusePly™ is a composite bonding technology that addresses manufacturing challenges. FusePly™ features benefits such as improved reliability, lower assembly time, design freedom, lightweight, and more. 
  • SurfaceMaster® - Syensqo’s SurfaceMaster® composite surfacing films reduce surface defects by 95% or more, offering superior handling properties that make manufacturing easier. SurfaceMaster® is the standard for composite materials surfacing because it eliminates surface imperfections, works with a variety of prepregs and processing cycles, features improved mold release-ability, and more.
  • Torlon® PAI - Torlon® PAI thermoplastic polymer offers best-in-class friction and wear performance alongside resistance to a wide range of chemicals. This family of polyamides is ideal for nuclear submarines, aircraft, ball valve seats, and other needs for naval vessels. 
  • KetaSpire® PEEK - Thermoplastic polymers like KetaSpire® PEEK are the material of choice of manufacturers producing aircraft systems, naval vessels, and other defense applications. With outstanding strength and electrical conductivity properties, KetaSpire® PEEK offers outstanding resistance properties for end-use scenarios and manufacturing. 
  • Ryton® PPS - Ryton® PPS thermoplastic polymer provides remarkable resistance properties that lower costs, reduce fuel consumption, and outperform the competition in high-temperature scenarios. Ryton® PPS performs best for aircraft and systems needs, including electrical connectors, covers, shields, fuel system components, and switches.