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FLEXWRAP FW 5068 is a cotton fabric impregnated with an elastomer modified phenolic resin.

MXS 1022HP is an 8 harness satin weave silica fabric impregnated with a Mil-R-9299 Grade A phenolic resin.

HT® 424 is an aluminum filled, modified epoxy phenolic resin film adhesive.

CPH® 2280/7576 is a glass fabric, style 7576, impregnated with a high temperature, low free phenol phenolic resin.

CA® 6304 is a 1583 style glass fabric impregnated with a high temperature elastomer modified phenolic resin.

BR® 6565 is a 250°F (121°C) staging, 350°F (177°C) curing cyanate ester syntactic paste foam with a service temperature range of -70°F to 350°F (-57°C to 177°C)

FusePly® 350 is a technology designed to achieve reliable bonding.

CYCOM® EP2190 is a highly toughened resin formulated with the most advanced epoxy chemistry and optimized for structurally efficient structure.

L-526 is a 275°F (135°C) curing phenolic resin with excellent elevated temperature properties.

L-530 is a modified epoxy prepreg with increased flame resistance.

SURFACE MASTER® 905 is a next generation surface film that delivers a step increase in surface quality versus currently available products. Use of SURFACE MASTE

250°F (121°C) cure toughened general purpose epoxy film adhesiveType: film | Temp: service temp < 320F | Process: autoclave | Proc Temp: 250 (121) | RT Lap:

Toughened epoxy optimized for damage tolerance.Type: thermoset composite | Temp: service temp < 320F | Process: out of autoclave | CAI KSI: medium | OHC Wet:

CYCOM® 5250-4HT is a 375°F (190°C) curing bismaleimide resin with a service temperature range of -75˚F to 475˚F (-59˚C to 246˚C).

CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower tem

350°F to 400°F (177°C to 204°C) curing bismaleimide resin with a service temperature range of -75°F to 400°F (-59°C to 204°C). High-strain carbon fibers and imp

MXB-6001/1581 is an E-glass fabric impregnated with a phenolic resin

METLBOND® 1113 is a modified epoxy film adhesive with a cure temperature range of 200 to 290°F (93 to 143°C).

FM®99 is a modified epoxy-based adhesive film designed for surfacing of composite structures.

CYCOM® E-293 is a 325°F (163°C) curing, clear stabilized epoxy resin.