250°F (121°C) cure toughened general purpose epoxy film adhesiveType: film | Temp: service temp < 320F | Process: autoclave | Proc Temp: 250 (121) | RT Lap: 6680 (46.1) | Elev Lap: 4400 (30.4) at 180°F (82°C) | RT Peel: 87 (MTM), 95 (HCSP) | TG: 169 (76) | Flow: 325 - 350 | Flat Tens: 1300 (8.96)
Markets
| Segments | Applications | End uses |
|---|---|---|
| Defense | Next-generation aircraft | |
| Fixed Wing Aircraft | Structures | Wings and Empennages |
| Fixed Wing Aircraft | Structures | Fuselages |
| Rotocraft | Fixed Primary Structures |
Processing Method
- Autoclave
- Compression Molding
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Thermoset composite | Epoxy |
Product Functions
- Medium Service Temperature (70°C to 150°C)
Format
| Physical form |
|---|
|
Adhesives
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Region of availability
- Africa & Middle East
- Not available in Asia Pacific
- Europe
- Not available in Latin America
- North America