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KetaSpire® KT-820 NT

Chemical category - PEEK (Polyetheretherketone)
Low melt flow for extrusion and injection molding, lubricated
Product functions: Colorable, Good Surface Finish, Halogen Free, Bromine Free, Low VOC, High Purity, Chlorine Resistant, High ESCR (Stress Crack Resist.), Good Dimensional Stability, Sour Gas Resistant, Good Glycol Resistance, Bio-Fuel Resistant, Fuel Resistant, Alkali Resistant, Acid Resistant, Alcohol Resistant, Mineral/Synthetic Oil Resistant, Detergent Resistant, Hydrolysis Resistant, Low Moisture Absorption, Dielectric Properties, Flame Retardant, Lubricated, Good Tear Strength, Fatigue Resistant, Friction/Wear Improved, High Hardness, High Stiffness, Creep Resistant, Good Impact Resistant, Low CLTE, Low Warpage, Good Processing Stability, Carbon Fibre Reinforcement, Glass Fibre Reinforcement, Good Thermal Stability, High Heat Resistant

CYCOM® 5320-1

Chemical category - Epoxy
CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower tem
Product functions: High Service Temperature (>150°C)

CYCOM 5250-4

Chemical category - BMI
350°F to 400°F (177°C to 204°C) curing bismaleimide resin with a service temperature range of -75°F to 400°F (-59°C to 204°C). High-strain carbon fibers and imp
Product functions: High Service Temperature (>150°C)

AVIMID S

Chemical category - Polyimide
Avimid® S is a high temperature cross linked polyimide composite with wet service capability up to 550°F (287°C) and dry service capability up to 630°F (332°C).
Product functions: High Service Temperature (>150°C)

Highlight DAPCO™ 2100

Chemical category - Silicone
Dapco™ 2100 is an adhesive, solvent-free, thixotropic silicone paste. Dapco™ 2100 is most commonly used as a coating
Product functions: High Service Temperature (>150°C)

Highlight DAPCO™ 2200

Chemical category - Silicone
Dapco™ 2200 is an adhesive, two-component, solvent-free, thixotropic silicone paste.
Product functions: High Service Temperature (>150°C)

CYCOM 934

Chemical category - Epoxy
Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: low | OHC Wet: low | TG Wet: 320 (160) | Proc Temp: 3
Product functions: High Service Temperature (>150°C)

CYCOM® PR 520N RTM

Chemical category - Epoxy
CYCOM® PR 520N RTM is a one-part, 179°C (355°F) curing epoxy resin system offering superior damage tolerance and good strain to failure required for composite p
Product functions: High Service Temperature (>150°C)

CYCOM 5250-4 RTM

Chemical category - BMI
CYCOM® 5250-4 RTM is a true one-part homogeneous BMI resin developed specifically for the resin transfer molding (RTM) process.
Product functions: High Service Temperature (>150°C)

Metlbond 2550

Chemical category - BMI
METLBOND® 2555 is a 350°F (177°C) cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and
Product functions: High Service Temperature (>150°C)

FM 410-1

Chemical category - Epoxy
A modified epoxy adhesive foam containing no metallic fillers designed for honeycomb splicing under ambient pressureType: core splice foam | Temp: service temp
Product functions: High Service Temperature (>150°C)

Torlon® AI-10 LM

Chemical category - PAI (Polyamide-imide)
Low MDA version of AI-10
Product functions: Fuel Resistant, Acid Resistant, Mineral/Synthetic Oil Resistant, Dielectric Properties, Non Flammable, Flame Retardant, High Hardness, Low CLTE, Good Adhesion, Laser Weldable, Good Processing Stability, Good Thermal Stability, High Heat Resistant