A modified epoxy adhesive foam containing no metallic fillers designed for honeycomb splicing under ambient pressureType: core splice foam | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 225 - 350 (107 - 177) | Serv Temp: 350 (177) | Expan Ratio: 1.7X - 3.5X
Markets
| Segments | Applications | End uses |
|---|---|---|
| Defense | Next-generation aircraft | |
| Defense | Rotorcrafts | |
| Propulsion | Nacelles | Fan Cowls |
| Fixed Wing Aircraft | Structures | Wings and Empennages |
Processing Method
- Autoclave
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Thermoset composite | Epoxy |
Product Functions
- High Service Temperature (>150°C)
Format
| Physical form |
|---|
|
Adhesives
|
Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America