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CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower tem

350°F to 400°F (177°C to 204°C) curing bismaleimide resin with a service temperature range of -75°F to 400°F (-59°C to 204°C). High-strain carbon fibers and imp

Avimid® S is a high temperature cross linked polyimide composite with wet service capability up to 550°F (287°C) and dry service capability up to 630°F (332°C).

Dapco™ 2100 is an adhesive, solvent-free, thixotropic silicone paste. Dapco™ 2100 is most commonly used as a coating

Dapco™ 2200 is an adhesive, two-component, solvent-free, thixotropic silicone paste.

Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: low | OHC Wet: low | TG Wet: 320 (160) | Proc Temp: 3

CYCOM® PR 520N RTM is a one-part, 179°C (355°F) curing epoxy resin system offering superior damage tolerance and good strain to failure required for composite p

CYCOM® 5250-4 RTM is a true one-part homogeneous BMI resin developed specifically for the resin transfer molding (RTM) process.

METLBOND® 2555 is a 350°F (177°C) cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and

A modified epoxy adhesive foam containing no metallic fillers designed for honeycomb splicing under ambient pressureType: core splice foam | Temp: service temp