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Lavanta® HPP

Better Performance, Longer Life

Lavanta® HPP specialty polymer has been specifically designed for display applications for the Electrical and Electronics market.

It offers high initial whiteness of the assembled LED, and maintains high reliability and excellent luminosity retention over the product service life.

Lavanta® HPP  also exhibits high deflection temperature, tensile strength, elongation at break and low moisture absorption. It can be easily molded using conventional injection molding equipment and methods.

It is a good alternative to thermoset materials as it is not only more environmentally friendly but also more cost-friendly.

Why Lavanta® HPP?

  • Higher heat resistance
  • Greater light stability
  • Longer life than competitive materials used for LED TV applications

Learn more about Lavanta® HPP properties

 

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Market Applications

In the Electrical & Electronics market, the growing trend among TV manufacturers is to reduce cost by using fewer LEDs with higher amperage. This results in greater brightness and significantly higher junction temperatures that are above 100°C (212°F).

Lavanta® HPP polyesters provide higher heat resistance and better light stability than previously used materials, which discolor prematurely in applications such as reflector cups.

Lavanta® HPP is also suited for LEDs used in general lighting for indoor and outdoor applications. 

 

Product Line

Surface Mount LED Grade

  • Lavanta® 5115 WH 308 and WH 224 are 15% glass fiber reinforced injection molding compounds specifically developed for surface-mount LEDs.
    This high-heat polymer delivers over 95% reflectivity and has excellent whiteness retention after thermal and light aging, making it ideally suited for LEDs that operate at high junction temperatures.
  • Lavanta® 5115 WH 308 and WH 224 can fill very thin-walled sections required for low-profile, side-view LEDs and offer low warpage and exceptional weld-line strength.
  • Lavanta® 5115 WH 308 provides even better performances under a wide range of silicon encapsulation processes.