METLBOND® 2555 is a 350°F (177°C) cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and low loss tangent electrical properties.Typical applications include honeycomb sandwich construction, metal-to-metal bonding, metal-to-composite bonding, composite-to-composite bonding, and 350°F (177°C) cure satellite structure applications.Other products in this cyanate ester family include CYCOM® 5575-3 Glass and Quartz Prepregs, FM® 2525 Adhesive, FM® 6555-1 and BR® 6565 Syntactic Foams.Features and Benefits:Low dielectric constant and loss tangent for radome applicationSuitable for bonding both metals and composites; co-cure with most 350°F (177°C) cure prepregsLow out-gassing and low moisture absorptionService temperature up to 450°F (232°C) with post cure