350°F(177°C) cure toughened epoxy film adhesiveType: film | Temp: service temp < 320F, 320F 500F | Process: autoclave | Proc Temp: 350 (177) | RT Lap: 3500 (24.13) | Elev Lap: 1970 (13.6) at 350°F (177°C) | RT Peel: 16 (MTM), 60 (HCSP) | TG: - | Flow: - | Flat Tens: 1210 (8.34)
Markets
| Segments | Applications | End uses |
|---|---|---|
| Fixed Wing Aircraft | Structures | Fuselages |
| Fixed Wing Aircraft | Structures | Wings and Empennages |
| Defense | UAVs / Drones |
Processing Method
- Autoclave
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Thermoset composite | Epoxy |
Product Functions
- High Service Temperature (>150°C)
Format
| Physical form |
|---|
|
Adhesives
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Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America
region note