250°F (121°C) cure film adhesive and surfacing filmType: film, surfacing film | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 250 (121) | RT Lap: 4850 (33.5) | Elev Lap: 5150 (35.5) at 180°F (82°C) | RT Peel: 21 (MTM), 21 (HCSP) | TG: - | Flow: 400 - 450 | Flat Tens: 892 (6.15) | Lightning: Y
Markets
| Segments | Applications | End uses |
|---|---|---|
| Defense | Next-generation aircraft | |
| Defense | Rotorcrafts | |
| Advanced Air Mobility | Lightweight Drones | Structures |
| Defense | UAVs / Drones |
Processing Method
- Autoclave
- Vacuum Bag Only
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Thermoset composite | Epoxy |
Product Functions
- Medium Service Temperature (70°C to 150°C)
Format
| Physical form |
|---|
|
Adhesives
|
Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America