FM® 209-1
FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite structures. This new adhesive provides similar performance in vacuum-only versus autoclave cure and has a unique combination of toughness and shear strength up to 250˚F (121˚C).
FM® 209-1 is designed for bonding metallic and composite substrates in monolithic and sandwich structures. It is compatible with most 250˚F (121˚C) and 350˚F (177˚C) curing epoxy-based prepreg systems for co-cure, co-bond and secondary bonding. FM® 209-1 adhesive film provides minimum shop life of 30 days at 75˚F (24˚C). FM® 209-1 adhesive has excellent resistance to both pre-bond and post- bond humidity exposures.
FM® 209-1 adhesive is supplied at various weights and thicknesses. It is featured as an unsupported film or as a supported film with woven, knit or mat carrier.
FM® 209-1 film adhesive can be cured within the temperature range of 160˚F to 350˚F (71˚C to 177˚C) under vacuum-only pressure. The standard cure cycle for FM® 209-1 is 250˚F (121˚C) for 90 minutes under full vacuum for out-of-autoclave (OOA) bonding applications or under 40 psi (0.28 MPa) pressure for autoclave cures.
Typical applications for FM® 209-1 include out-of-autoclave bonding of metal & composite monolithic/sandwich structures, low temperature cure applications, and low temperature good serviceability applications.
Features and Benefits
- 250˚F (121˚C) curing high performance metal and composite bonding film
- Designed for out-of-autoclave bonding of metal and composite monolithic and sandwich structures
- Builds sufficient green strength at 160˚F (71˚C) when co-cured with CYCOM® 5320-1 out-of-autoclave epoxy prepreg
- Excellent combination of high peel and shear properties from -65˚F to 250˚F (-54˚C to 121˚C)
- Excellent resistance to both pre-bond and post-bond humidity
- Service temperature of 250˚F (121˚C)
- Shop life of 30 days or more at 75˚F (24˚C)
- Dual curing capability; 250˚F (121˚C) and 350˚F (177˚C)
- Compatible with various solvent- and water- based bond primers
- Capable of low temperature curing, x ≤ 250˚F (121˚C)
- Recommended use with CYCOM® 5320-1, CYCOM® 977-2, and other epoxy prepregs
FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite structures. This new adhesive provides similar performance in vacuum-only versus autoclave cure and has a unique combination of toughness and shear strength up to 250˚F (121˚C).
FM® 209-1 is designed for bonding metallic and composite substrates in monolithic and sandwich structures. It is compatible with most 250˚F (121˚C) and 350˚F (177˚C) curing epoxy-based prepreg systems for co-cure, co-bond and secondary bonding. FM® 209-1 adhesive film provides minimum shop life of 30 days at 75˚F (24˚C). FM® 209-1 adhesive has excellent resistance to both pre-bond and post- bond humidity exposures.
FM® 209-1 adhesive is supplied at various weights and thicknesses. It is featured as an unsupported film or as a supported film with woven, knit or mat carrier.
FM® 209-1 film adhesive can be cured within the temperature range of 160˚F to 350˚F (71˚C to 177˚C) under vacuum-only pressure. The standard cure cycle for FM® 209-1 is 250˚F (121˚C) for 90 minutes under full vacuum for out-of-autoclave (OOA) bonding applications or under 40 psi (0.28 MPa) pressure for autoclave cures.
Typical applications for FM® 209-1 include out-of-autoclave bonding of metal & composite monolithic/sandwich structures, low temperature cure applications, and low temperature good serviceability applications.
Features and Benefits
- 250˚F (121˚C) curing high performance metal and composite bonding film
- Designed for out-of-autoclave bonding of metal and composite monolithic and sandwich structures
- Builds sufficient green strength at 160˚F (71˚C) when co-cured with CYCOM® 5320-1 out-of-autoclave epoxy prepreg
- Excellent combination of high peel and shear properties from -65˚F to 250˚F (-54˚C to 121˚C)
- Excellent resistance to both pre-bond and post-bond humidity
- Service temperature of 250˚F (121˚C)
- Shop life of 30 days or more at 75˚F (24˚C)
- Dual curing capability; 250˚F (121˚C) and 350˚F (177˚C)
- Compatible with various solvent- and water- based bond primers
- Capable of low temperature curing, x ≤ 250˚F (121˚C)
- Recommended use with CYCOM® 5320-1, CYCOM® 977-2, and other epoxy prepregs
Markets
| Segments | Applications | End uses |
|---|---|---|
| Advanced Air Mobility | Air Taxis / Heavy Goods Cargos | Structures |
| Advanced Air Mobility | Large Cargo Drones | Structures |
| Defense | Next-generation aircraft | |
| Defense | UAVs / Drones |
Processing Method
- Autoclave
- Vacuum Bag Only
- Compression Molding
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Thermoset composite | Epoxy |
Product Functions
- Medium Service Temperature (70°C to 150°C)
Format
| Physical form |
|---|
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Adhesives
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Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America