CYCOM® 5920 modified epoxy laminating resin is a toughened, low exotherm, 250°F (121°C) curing, general purpose system. It was expressly formulated to cure in ultra-thick laminates without developing "hot" spots or a runaway exotherm. Sections of up to 3.5" (88.9mm) thick have successfully been made using glass fabric reinforcement.
CYCOM® 5920 is vacuum bag - oven curable. However, optimum properties are obtained by curing under fluid pressure to 100 Psi (.7Mpa) at 250°F (121°C) for two hours. CYCOM® 5920 has good tack and drape, and an out time of two weeks at room temperature.
This system also possesses an unusually long open time prior to cure. Layed-up panels, stored for 6 months at 75 +/- 10°F (24 +/- 5.6°C), have been successfully cured to give very acceptable mechanical performance, although the flow is reduced with time.
Markets
| Segments | Applications |
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Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Adhesives & surfacing | Epoxy |
Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America