CYCOM® 5575 is a 350°F (177°C) curing modified cyanate ester resin with a service temperature range up to 350°F (177°C). CYCOM® 5575 prepregs are available in two flow variations, CYCOM® 5575-2 and CYCOM® 5575-3, with quartz and glass fabric reinforcement options. CYCOM® 5575-3 is equivalent to CYCOM® 5575-2 but with reduced flow for honeycomb sandwich bonding.
Typical applications include radomes, antenna structures, low observables structures, and low dielectric and loss tangent substrates for military and commercial applications.
Features and Benefits
• Low dielectric constant and loss tangent
• Service temperature up to 350°F (177°C)
• Autoclave or press curable (CYCOM® 5575-3 also VBO cure curable)
• Excellent hot/wet mechanical performance
• Low moisture absorption, low out-gassing properties
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