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CORFIL 5250-4

Product functions: High Service Temperature (>150°C)
CORFIL® 5250-4 is a single component, non-metallic filled, syntactic material formulated for use in insert potting, edge filling, and core filling of high temperature honeycomb sandwich structures.
CORFIL® 5250-4 is based on bismaleimide (BMI) chemistry and is available in six and twelve ounce easy-to-use cartridges.
Typical applications for CORFIL® 5250-4 include honeycomb core filling, insert potting and edge filling in BMI composite honeycomb sandwich panel construction.

Features and Benefits 
- Use in metallic and non-metallic honeycomb 
- Excellent compressive strength up to 475⁰F (246⁰C) 
- Easily spreadable 
- Co-curable with BMI composite materials, i.e. CYCOM® 5250-4

Markets

Segments Applications
Defense Next-generation aircraft
Defense UAVs / Drones

Processing Method

  • Autoclave

Chemical categories

Chemical category Chemical family Chemical product
Composite materials Thermoset composite BMI

Product Functions

  • High Service Temperature (>150°C)

Format

Physical form
Resins for Infusion

Region of availability

  • Africa & Middle East
  • Asia Pacific
  • Europe
  • Latin America
  • North America

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