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BR 624 POTTING COMPOUND 1'S

Product functions: Medium Service Temperature (70°C to 150°C)
BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction. It is a thermosetting, modified epoxy system, serviceable over a temperature range of -70 – 350°F (-57 – 177°C). 

BR® 624 potting compound is thixotropic and cure cycles may be varied over a broad range. Cure temperatures as low as 225°F (107°C) and as high as 350°F (177°C) have been used successfully. Multiple cure cycles at temperatures up to 350°F (177°C) will not impair its use as a structural material.
 
Features & Benefits
•     Structural properties from -67°F to 400°F (-55°C to 204°C) 
•     Compatibility with most 350°F (177°C) service temperature adhesives
•     Protects prepared surfaces from further oxidation
•     Improves hydrolytic stability at the adhesive-to-metal interface
 
SUGGESTED APPLICATIONS
•     Insert and edge filling of honeycomb structures

Markets

Segments Applications End uses
Fixed Wing Aircraft Structures Wings and Empennages
Fixed Wing Aircraft Structures Fuselages
Rotocraft Fixed Primary Structures

Processing Method

  • Autoclave
  • Compression Molding

Chemical categories

Chemical category Chemical family Chemical product
Composite materials Thermoset composite Epoxy

Product Functions

  • Medium Service Temperature (70°C to 150°C)

Format

Physical form
Others

Region of availability

  • Africa & Middle East
  • Asia Pacific
  • Europe
  • Latin America
  • North America

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