BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction. It is a thermosetting, modified epoxy system, serviceable over a temperature range of -70 – 350°F (-57 – 177°C).
BR® 624 potting compound is thixotropic and cure cycles may be varied over a broad range. Cure temperatures as low as 225°F (107°C) and as high as 350°F (177°C) have been used successfully. Multiple cure cycles at temperatures up to 350°F (177°C) will not impair its use as a structural material.
Features & Benefits
• Structural properties from -67°F to 400°F (-55°C to 204°C)
• Compatibility with most 350°F (177°C) service temperature adhesives
• Protects prepared surfaces from further oxidation
• Improves hydrolytic stability at the adhesive-to-metal interface
SUGGESTED APPLICATIONS
• Insert and edge filling of honeycomb structures
Markets
Segments | Applications | End uses |
---|---|---|
Fixed Wing Aircraft | Structures | Wings and Empennages |
Fixed Wing Aircraft | Structures | Fuselages |
Rotocraft | Fixed Primary Structures |
Processing Method
- Autoclave
- Compression Molding
Chemical categories
Chemical category | Chemical family | Chemical product |
---|---|---|
Composite materials | Thermoset composite | Epoxy |
Product Functions
- Medium Service Temperature (70°C to 150°C)
Format
Physical form |
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Others
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Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America